Optomec Decathlon AJ5X
Abstract
The system acquired in this project enables the additive fabrication of low‑inductance, ultra‑flat chip interconnects as well as passive electrical structures on two‑ and three‑dimensional substrates. In modern quantum systems, packaging and interconnection technology often represents a major bottleneck for further miniaturization—particularly due to the height and parasitic inductance of conventional wire‑bond contacts.
With the new system, contact heights of only a few micrometres and extremely short interconnect lengths can be achieved, significantly reducing parasitic inductance. Because the device can print both the electrical contacts and the coil or resonator structures required for spin‑based qubits in a single process step, parasitic inductances in the range of only a few hundred picohenry become possible. This enables direct driving of the coil or resonator without the usual 50‑Ω impedance matching, which substantially improves energy efficiency and reduces power dissipation in future integrated quantum systems.
In addition, the system supports the metallization of arbitrary 3D geometries, allowing the fabrication of three‑dimensional microcoils and microresonators. Such 3D structures generate significantly more homogeneous high‑frequency magnetic fields than planar designs—an essential requirement for nearly all modern pulsed control sequences used in spin‑qubit systems.
By combining 3D‑printed forms, additive metallization, and precise low‑inductance interconnects, the system enables the realization of highly integrated, energy‑efficient quantum devices that surpass the current state of the art and can potentially be manufactured at medium production volumes. The instrument will therefore be used to explore new concepts for enhancing the performance and miniaturization of quantum sensors through hybrid micro‑integration.
ERDF funding
Grant under the European Regional Development Fund (ERDF) in Baden‑Württemberg 2021–2027 within the framework of the administrative regulation of the Ministry of Science, Research and the Arts for strengthening research, technological development and innovation at state universities in Baden‑Württemberg (VwV EFRE FEIH 2021–2027)
Project: Printer for the micro‑hybrid integration of quantum devices
Funding reference: 2698219
DFG funding
Grant by the German Research Foundation (DFG) within the “Major Research Instrumentation” program pursuant to Article 91b of the German Basic Law
Project: Printer for ultra‑flat chip interconnects and 3D metallization
Funding reference: INST 41/1233‑1 FUGG